Camera module

ABSTRACT

A first exemplary embodiment of the present disclosure includes a PCB (Printed Circuit Board) mounted with an image sensor, a holder member mounted on the PCB, a lens module directly mounted inside the holder member, an actuator arranged at an inside of the holder member, and an electronic circuit pattern formed on a surface of the holder member to conductibly connect the PCB and the actuator, where one end of the electronic circuit pattern is connected to the PCB, and the other end of the electronic circuit pattern is connected to the actuator.

Pursuant to 35 U.S.C. §119 (a), this application claims the benefit ofearlier filing date and right of priority to Korean Patent ApplicationNo. 10-2012-0083027, filed on Jul. 30, 2012, the contents of which arehereby incorporated by reference in their entirety.

BACKGROUND OF THE DISCLOSURE

1. Field of Endeavor

The teachings in accordance with exemplary and non-limiting embodimentsof this disclosure relate generally to a camera module.

2. Background

In a case an auto focusing operation is carried out in a conventionalcamera module, an AF (Auto Focus) terminal and a PCB AF pad must beconductibly connected to drive an actuator, which is disadvantageouslysusceptible to shock.

Particularly, development of a camera module configured to maintain anauto focusing function and handshake compensation function, and yet tominimize a height of the camera module is required by a user needs to aslimmer camera module installed on small-sized electronic products suchas notebooks, smart phones and tablet personal computers.

SUMMARY OF THE DISCLOSURE

Exemplary and non-limiting embodiments of this disclosure are to providea structure-improved camera module configured to maintain an autofocusing function and handshake compensation function, and yet tominimize a height of the camera module.

In a first exemplary embodiment of the present disclosure, there isprovided a camera module, the camera module comprising: a PCB (PrintedCircuit Board) mounted with an image sensor;

a holder member mounted on the PCB;a lens module directly mounted inside the holder member;an actuator arranged at an upper surface of the holder member; andan electronic circuit pattern formed on a surface of the holder memberto conductibly connect the PCB and the actuator, where one end of theelectronic circuit pattern is connected to the PCB, and the other end ofthe electronic circuit pattern is connected to the actuator.

In some exemplary embodiments of the present disclosure, the lens modulemay be formed by any one of a lens unit formed with one or more lensesand a lens barrel arranged with lenses.

In some exemplary embodiments of the present disclosure, the cameramodule may further comprise a shield can wrapping a lateral surface andan upper surface of the holder member, an insulation member may beinterposed between the shield can and the holder member, and theinsulation member may be an epoxy.

In some exemplary embodiments of the present disclosure, a protectiveguide member may be interposed between the shield can and the holdermember, and the protective guide member may prevent an exposed surfaceof the electronic circuit pattern formed at an upper surface of theholder member from being short-circuited with the shield can.

In a second exemplary embodiment of the present disclosure, there isprovided a camera module, the camera module comprising:

a PCB (Printed Circuit Board) mounted with an image sensor; a guideholder mounted on the PCB;a lens module directly mounted inside the holder member;an actuator arranged inside the guide holder; andan electronic circuit pattern formed on a surface of the holder memberto conductibly connect the PCB and the actuator, where one end of theelectronic circuit pattern is connected to the PCB, and the other end ofthe electronic circuit pattern is connected to the actuator.

In some exemplary embodiments of the present disclosure, the guideholder may be formed with the electronic circuit pattern at a lateralsurface, an upper surface and at an inner circumferential surfaceaccommodated by the actuator, and a shield can may be included thatwraps a lateral surface of the guide holder while being discrete from anupper surface.

In some exemplary embodiments of the present disclosure, an insulationmember may be interposed between the shield can and the guide holder.

In a third exemplary embodiment of the present disclosure, there isprovided a camera module, the camera module comprising:

a PCB (Printed Circuit Board) mounted with an image sensor; an actuatorholder mounted at an upper surface of the PCB and formed at an uppersurface with a through hole;a lens module directly mounted inside the actuator holder member;an actuator arranged inside the actuator holder; andan electronic circuit pattern formed on a surface of the actuator holderto conductibly connect the PCB and the actuator, where one end of theelectronic circuit pattern is connected to the PCB, and the other end ofthe electronic circuit pattern is connected to the actuator.

In some exemplary embodiments of the present disclosure, an uppersurface of the actuator holder may be so formed as to wrap the actuator,and the through hole may be arranged at a position corresponding to aterminal unit of the actuator.

In some exemplary embodiments of the present disclosure, at least twothrough holes may be provided.

In some exemplary embodiments of the present disclosure, the electroniccircuit pattern may be formed at a lateral surface and an upper surfaceof the actuator and at an inner circumferential surface of the throughhole.

In some exemplary embodiments of the present disclosure, the actuatormay be connected to the electronic circuit pattern at a surface facingthe through hole.

In a fourth exemplary embodiment of the present disclosure, a cameramodule may be formed with a configuration same as that of the thirdexemplary embodiment of the present disclosure, but may be additionallyformed with an outermost lens arranged at an upper surface of theactuator.

In some exemplary embodiments of the present disclosure, a diameter ofthe outermost lens may be formed smaller than that of the actuator orother lenses.

The actuator according to the first to fourth exemplary embodiments ofthe present disclosure may include any one of a MEMS (Micro ElectricMechanical System) actuator moved by using an electrostatic force and apiezoelectric force, a liquid crystal lens, a piezoelectric polymerlens, a non-MEMS actuator, a silicon type actuator, and a liquid lens,or a combination of at least two such actuators.

In some exemplary embodiments of the present disclosure, the actuatormay perform an auto focusing function or a handshake compensationfunction through changes in thickness or shape of a fixed lens orchanges in refractive indexes of incident light.

In some exemplary embodiments of the present disclosure, the electroniccircuit pattern and the actuator may be connected using a soldering, anAg epoxy, a conductive epoxy or a wire bonding.

Exemplary embodiments of the present disclosure have an advantageouseffect in that handshake compensation function and auto focusingfunction can be performed by changes in refractive indexes of incidentlight and changes in thickness or shapes of fixed lens, free fromhorizontal, vertical and tilting movement of a lens, and a height of acamera module can be reduced to enable a miniaturization of the cameramodule.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 and 2 are schematic cross-sectional views illustrating a cameramodule according to a first exemplary embodiment of the presentdisclosure.

FIG. 3 is a schematic cross-sectional view illustrating a camera moduleaccording to a second exemplary embodiment of the present disclosure.

FIG. 4 is a schematic cross-sectional view illustrating a camera moduleaccording to a third exemplary embodiment of the present disclosure.

FIG. 5 is a schematic cross-sectional view illustrating a camera moduleaccording to a fourth exemplary embodiment of the present disclosure.

FIG. 6 is a schematic cross-sectional view illustrating a camera moduleaccording to a fifth exemplary embodiment of the present disclosure.

FIG. 7 is a perspective view illustrating an example of an actuatorapplicable to the first to fifth exemplary embodiments of the presentdisclosure.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments of the present disclosure will bedescribed in detail with reference to the accompanying drawings.

FIGS. 1 and 2 are schematic cross-sectional views illustrating a cameramodule according to a first exemplary embodiment of the presentdisclosure, FIG. 3 is a schematic cross-sectional view illustrating acamera module according to a second exemplary embodiment of the presentdisclosure, FIG. 4 is a schematic cross-sectional view illustrating acamera module according to a third exemplary embodiment of the presentdisclosure, FIG. 5 is a schematic cross-sectional view illustrating acamera module according to a fourth exemplary embodiment of the presentdisclosure, FIG. 6 is a schematic cross-sectional view illustrating acamera module according to a fifth exemplary embodiment of the presentdisclosure, and FIG. 7 is a perspective view illustrating an example ofan actuator applicable to the first to fifth exemplary embodiments ofthe present disclosure.

The camera module according to the first to fifth exemplary embodimentsof the present disclosure is a focus non-adjusting type camera modulehaving no focusing process. That is, the focus non-adjusting type cameramodule may include a holder member (20), where an inner surface of theholder member (20) may be directly mounted with a lens unit (30) formedwith at least one lens or a lens module formed with a lens barrel (notshown). Now, a configuration where the lens unit (30) is directlymounted at an inner surface of the holder member (20) will be describedaccording to the first to fifth exemplary embodiments of the presentdisclosure.

Referring to FIGS. 1 and 2, a camera module according to the firstexemplary embodiment of the present disclosure includes a PCB (10), aholder member (20), and an actuator (40).

The PCB (10) may be formed with an image sensor (11) at an approximatecenter thereof to read out image information, and may be mounted at asurface thereof with the image sensor (11) and a controller outputtingdata and a control signal of the actuator (40). At this time, theactuator (40) and the PCB (10) may be conductibly connected to anelectronic circuit pattern (100) formed on a surface of the holdermember (20) by using a surface electrode pattern forming technology.Also, the electronic circuit pattern (100) can be electronic circuitpattern.

The holder member (20) may be arranged on an upper surface of the PCB(10) and may be directly mounted with a lens unit (30) formed thereinwith one or more lenses. That is, the holder member (20) and the lensunit (30) may be integrally formed to be insert injection molded, or thelens may be directly coupled to the holder member (20).

Furthermore, the actuator (40) may be installed at any one place of anupper surface of the holder member (20), an upper surface of the lensunit (30), an upper surface of a first lens (31) of the lens unit (30),an upper surface of lens module and a first lens (31) of the lensmodule. The actuator (40) can automatically adjust a focus of an imagecaptured by the image sensor (11). The configuration of the actuator(40) will be described in detail later.

A surface of the holder member (20) may be formed with an electroniccircuit pattern (100) conductively connected to the PCB (10). Theelectronic circuit pattern (100) is formed to allow a surface of theholder member (20) to have a wiring pattern. The electronic circuitpattern (100) may be formed using the so-called surface electrodepattern forming technology, or may be formed by insert injection moldingof metal-materialed wiring members.

A distal end of the electronic circuit pattern (100) is connected to thePCB (10), and the other opposite distal end of the electronic circuitpattern (100) is conductively connected to the actuator (40). Thus, theactuator (40) and the PCB (10) may be conductively connected by theelectronic circuit pattern (100).

The surface electrode pattern forming technology may be categorized intothree methods.

A first method is a patterning method using a dual forming, where a partforming the holder member (20) and a part forming the electronic circuitpattern (100) are injection molded using mutually different syntheticresins. That is, the part of the holder member (20) is injection-moldedis injection-molded using an insulation material, while the part forforming the electronic circuit pattern (100) is injection molded with aconductible synthetic resin, or with a metal plating-easy syntheticresin, and the electronic circuit pattern (100) is completed by using apost processing such as electroplating.

The second method is such that the holder member (20) is injectionmolded with impurities reactive to heat and light included, and anexposed lateral wall surface to be formed with the electronic circuitpattern (100) is laser-exposed via a surface patterning process to theinjection-molded holder member (20) such as laser lithography to formthe electronic circuit pattern (100) thereon. If the electronic circuitpattern (100) is formed by the above method, SMDs (surface-mountdevices) or electronic accessory parts can be directly mounted becausethe electronic circuit pattern (100) itself has a conductible property.

Meanwhile, the third method is a method in which an entire surface ismetalized, where an entire surface of the holder member (20) ismetalized to form the electronic circuit pattern (100) on the exposedsurface. That is, only the part to be formed with the electronic circuitpattern (100) remains untouched while the remaining part is etched toallow the electronic circuit pattern (100) to be integrally formed onthe surface of the holder member (20).

Meanwhile, the electronic circuit pattern (100) provided by the abovesurface electrode pattern forming technology is formed on the exposedsurface of the holder member (20). However, the present disclosure isnot limited thereto, and the electronic circuit pattern (100) may beformed both on the exposed external surface of the holder member (20)and on the non-exposed internal surface of the holder member (20), orformed on any one of exposed or non-exposed surface. This is to selectthe arrangement of the electronic circuit pattern (100) on a singlesurface or a double surface according to wiring requirement forcomponent mounting. Hence, if there is a need to mount a large number ofelectronic components, an exterior surface of the holder member (20) andan interior surface are also formed by the above methods with theelectronic circuit pattern (100) to which components can be mounted.

Meanwhile, the connection through mechanism or equipment of insertmethod may be possible, instead of forming the electronic circuitpattern (100) using the above surface electrode pattern formingtechnology. That is, the insert injection may be used when the holdermember (20) is injection molded for metal-materialed terminal member forforming the electronic circuit pattern (100).

If the electronic circuit pattern (100) is thus formed on the surface ofthe holder member (20), there is no need of preparing a separateconnection member such as a PCB as illustrated in FIG. 1. As a result,the actuator (40) and a terminal of the PCB (10) can be directlyconnected using the electronic circuit pattern (100) formed on thesurface of the holder member (20), whereby a space for installingcomponents can be reduced for easy application to miniaturizedelectronic products, and assembly process can be simplified to enhancethe reliability as well.

The lens unit (30) is sequentially arranged with at least one sheet oflenses to capture an external image toward the image sensor (11). Atthis time, the lenses may be installed in the middle thereof with aseparate optical mechanism including a shutter unit and an aperture, ifnecessary.

That is, the lens unit (30) may be sequentially arranged with at leastone or more sheets of lenses, and in a case two lenses are arranged onan optical path formed inside the lens unit (30), an optical mechanismformed by the aperture and the shutter unit may be arranged at a spacebetween two sheets of lenses, at a space between the lenses and theactuator (40), or at an upper surface of an extreme outer lens, or at abottom surface of the lens. This arranged relationship may be changed inresponse to a product design and configuration of camera unit.

An interior of the holder member (20) may be directly coupled by thelens unit (30) according to a first exemplary embodiment of the presentdisclosure. Furthermore, the actuator (40) may be aligned at an uppersurface of the lens unit toward the upper surface of the holder member(20) coupled by the lens unit (30). A tolerance range generated by thealignment of the actuator (40) may be compensated by the actuator (40).

For example, the lens unit (30) is coupled to the holder member (20)based on infinite focusing, and at this time, the lens unit (30) iscoupled to the holder member (20) toward a plus (+) side, i.e., closerby 20 μm to 30 μm toward the image sensor (11) over a reference surfaceof infinite focusing. Furthermore, the actuator (40) at the time offocusing is operated by being compensated as much as an added distanceduring coupling to the lens unit (30). If the coupling without toleranceor toward a minus (−) side is made, long-range resolution maydeteriorate due to a short-range focusing.

Thus, the actuator (40) in the camera module according to the firstexemplary embodiment of the present disclosure can compensate thefocusing distance based on a position nearer to the image sensor (11).This is because there is a difference from the general focusing and autofocusing method in which a focusing distance is set and focused at 3-4 mto move the actuator (40) for auto focusing.

Meanwhile, although the first exemplary embodiment of the presentdisclosure has explained and described that the lens unit (30) isdirectly installed at an inner side of the holder member (20) dispensingwith a separate lens barrel, the present disclosure is not limitedthereto. For example, one or more sheets of lenses forming the lens unit(30) may be insert injection molded, if necessary, when the holdermember (20) is injection molded, and the lens unit (30) may be directlycoupled after formation of the holder member (20).

Alternatively, albeit not being illustrated, a lens barrelconventionally supporting a plurality of lenses may be fixedly arrangedinside the holder member to replace the lens unit (30).

Various structures may be used for the actuator (40). For example, asillustrated in FIG. 7, the actuator (40) may include a terminal unit (40a) and a variable lens (40 b). At this time, the actuator (40) is fixedand needs no movement. The actuator (40) may take various shapesincluding a circular shape and a doughnut shape in addition to thesquare shape illustrated in FIG. 7.

The terminal unit (40 a) may be installed at any one place of an uppersurface, a floor surface, a lateral surface and a surface extended froman upper surface to a lateral surface. The terminal unit (40 a) isconductively connected to the electronic circuit pattern (100), and maybe conductively connected to the electronic circuit pattern (100)through a connection unit (41) formed with a conductible memberincluding a conductible epoxy such as a solder and an Ag epoxy.

The variable lens (40 b) is arranged at an approximate center of theactuator (40) to allow light including an image to pass therethrough.The variable lens (40 b) may be formed in a convex shape. The variablelens (40 b) is changeable in refractive index in response to a controlsignal of a predetermined controller, whereby the light including theimage can change a focusing position captured by the image sensor (11).At this time, the variable lens (41) may be configured with an LC(Liquid crystal) lens, a liquid lens or a piezoelectric polymer lens.

Turning to FIG. 1 again, a width of the actuator (40) may be formedsmaller than that of the holder member (20). However, the presentdisclosure is not limited thereto, and as shown in FIG. 2, the actuator(40) may have a width corresponding to that of an upper surface of theholder member (20). In this case, the width of the actuator (40)preferably has a width smaller than that of holder member (20) forminiaturization of the camera module. The size of the holder member (20)may be changed based on the size of the integrally formed lens unit(30). The holder member (20) may take a variable shape including acylinder and a cube based on design of the camera module. However, theholder member (20) must be greater than the width of the actuator (40).

If the actuator (40) is formed smaller than the holder member (20), theactuator (40) is fixed to an upper surface of the lens unit (30) asillustrated in FIG. 1. Furthermore, a guide holder member (55) may bearranged at an upper surface of the holder member (20). The guide holdermember (55) serves to protect the actuator (40), and prevents the shieldcan (50) and the electronic circuit pattern (100) from beingshort-circuited by being interposed between the shield can (50) and theelectronic circuit pattern (100). The guide holder member (55) will bedescribed in detail later along with the shield can (50).

If the actuator (40) is formed greater than the lens unit (30), theactuator (40) is fixed to an upper surface of the holder member (20) asillustrated in FIG. 2. In this case, the shield can (50) may be arrangedby being discrete at a predetermined distance (G) from the upper surfaceof the actuator (40).

Meanwhile, although FIG. 1 has explained and described that the terminalunit (40 a) is formed at a floor surface of the actuator (40), thepresent disclosure is not limited thereto. For example, the terminalunit (40 a) may be formed at an upper surface or a lateral surface ofthe actuator (40) as described above. At this time, the electroniccircuit pattern (100) formed on the holder member (20) needs to change aheight of the holder member (20) to allow being changed in positionbased on the position of the terminal unit (40 a). For example, in acase the terminal unit (40 a) is formed at the upper surface of theactuator (40), a height of the upper surface of the holder member (20)may be formed in correspondence with the upper surface of the actuator(40). Then, the actuator (40) may be arranged inside the holder member(20).

According to the first exemplary embodiment of the present disclosure, asurface opposite to the image sensor (11) of the lens unit (30) may bearranged with an infrared cut-off member (21). However, the presentdisclosure is not limited thereto, and an infrared cut-off coating maybe performed on a plurality of lenses or variable lens forming the lensunit (30) dispensing with a separate infrared cut-off filter. In thiscase, an assembly process of a camera module can be reduced and theheight of the camera module can be lowered due to no need of a separateinfrared cut-off filter.

Although the first exemplary embodiment of the present disclosure hasexplained and described that the infrared cut-off member (21) isinstalled between an extreme rear lens of the lens unit (30) and theimage sensor (11) as illustrated in FIG. 1, the present disclosure isnot limited thereto, and the infrared cut-off member (21) may beprovided on an extreme first lens of the lens unit (30), or providedbetween a plurality of lenses mounted on the lens unit (30), or may becoated on the lenses, or an existing infrared cut-off filter member maybe formed inside a space unit. That is, any one surface of a lens in theplurality of lenses may be coated, or a separate infrared cut-off filtermember may be used.

Meanwhile, although the abovementioned exemplary embodiment of thepresent disclosure has described and illustrated that the actuator (40)is formed with the variable lens of an LC lens, liquid lens or apiezoelectric polymer lens, and refractive index of passing light ischanged, without physically moving one sheet of lens, to perform autofocusing and handshake compensating functions, it should be apparentthat the present disclosure is not limited thereto.

The actuator (40) may be so configured as to perform a zooming functionand a shutter function in addition to the auto focusing and handshakecompensating functions. Furthermore, the actuator (40) may be replacedby any actuator capable of controlling one sheet of lens such as anactuator using a piezoelectric polymer and movable by usingelectrostatic force or a piezoelectric force.

That is, by way of non-limiting example, the actuator may be any one ofa MEMS (Micro Electric Mechanical System) actuator capable of moving byusing the electrostatic force or the piezoelectric force, a MEMSpiezoelectric actuator, a MEMS bimorph actuator, an MEMS thermalactuator, a MEMS magnetic actuator, a MEMS liquid actuator, a non-MEMStype actuator, a silicon type actuator, and a liquid lens, or any typeof actuator that is configured by combination thereof.

Meanwhile, a metal-materialed shield can (50) may be separately formedat an outside of the holder member (20). In this case, an insulationmember (45) such as an insulation epoxy may be coated between theelectronic circuit pattern (100) and the shield can (50), wherebyshort-circuit can be prevented between the electronic circuit pattern(100) and the shield can (50) using the insulation member (45).

Furthermore, as in the first exemplary embodiment of the presentdisclosure illustrated in FIG. 1, a protective guide member (55) isinstalled at an upper surface of the holder member (20). The protectiveguide member (55) may be interposed between the electronic circuitpattern (100) and the shield can (50), whereby an upper surface of theprotective guide member (55) may be brought into a surface-contact withthe shield can (50), while an opposite surface may be brought into asurface-contact with the holder member (20).

Particularly, an upper surface of the holder member (20) is formed withan exposed surface where the electronic circuit pattern (100) isexposed. Thus, the protective guide member (55) may be brought intosurface-contact with the exposed surface to prevent the exposed surfaceof the electronic circuit pattern (100) from contacting the shield can(50).

Meanwhile, the protective guide member (55) may be formed with aninsulation material to prevent the conductively materialed shield can(50) from being contacted to and short-circuited with the electroniccircuit pattern (100). Furthermore, the protective guide member (55) mayalso prevent the electronic circuit pattern (100) exposed to the uppersurface of the holder member (20) from being damaged by interferencewith other components or infuse of foreign objects.

The protective guide member (55) may be formed higher than the actuator(40) to allow performing to protect the actuator (40), and may beprovided with various shapes including a ring shape, a square donutshape and a line shape.

Meanwhile, the exposed surface exposed by being formed at an uppersurface of the holder member (20) on the electronic circuit pattern(100) may be arranged on a same planar surface with a terminal providedon the actuator (40), and may be directly connected at the connectionunit (41) to the terminal or to a conductible member including a solder,or a conductive epoxy such as an Ag epoxy.

FIG. 3 is a schematic cross-sectional view illustrating a camera moduleaccording to a second exemplary embodiment of the present disclosure.

The camera module according to the second exemplary embodiment of thepresent disclosure is structurally same as that of the first exemplaryembodiment illustrated in FIG. 1, except that the protective guidemember (55) is provided with a guide holder (120) integrally formed withthe holder member (20).

The guide holder (120) is arranged at an upper surface of the PCB (10),and may be directly installed at an inside thereof with a lens unit (30)formed therein with one or more lenses. Thus, the lenses arranged on thelens unit (30) are integrally formed with the guide holder (120). Theguide holder (120) may be installed at an upper surface with an actuator(40) for automatically adjusting a focus of an image captured by theimage sensor (11).

At this time, a lug (121) having a shape corresponding to that of theprotective guide member (55, see FIG. 1) of the first exemplaryembodiment may be formed at an external lateral surface of the actuator(40). A height of an upper surface of the lug (121) may be higher thanthat of the upper surface of the actuator (40).

A surface of the guide holder (120) may be formed with the electroniccircuit pattern (100) conductively connected to the PCB (10) mountedwith the image sensor (11). At this time, the electronic circuit pattern(100) may be formed at a lateral surface of the guide holder (120), atan upper surface of the lug (120) and at an inner concavecircumferential surface installed with the actuator (40).

Hence, as illustrated in FIG. 3, a terminal unit (40 a) formed at thelateral surface of the actuator (40) may be conductively connected tothe electronic circuit pattern (100) formed at an exposed portion of theinner surface of the guide holder (120) through a connection unit (41)formed with a conductible member including a solder or conductive epoxysuch as an Ag epoxy.

At this time, the terminal unit (40A) may be formed at an upper surfaceof the actuator (40) as shown in FIG. 3( a), formed at a lateral surfaceof the actuator (40) as shown in FIG. 3( b), or formed at a floorsurface of the actuator (40) as shown in FIG. 3( c). The terminal unit(40 a) may be formed at a position corresponding to that of theelectronic circuit pattern (100) according to an arrangement position ofthe terminal unit (40 a).

Thus, according to this configuration, only the guide holder (120) canprevent the actuator (40) from being interfered with other componentsdispensing with a separate protective guide member (55, see FIG. 1).However, in a case a shield can (50) is added, the electronic circuitpattern (100) exposed on the upper surface of the guide holder (120) maybe discretely installed at a predetermined distance (G) from the shieldcan (50) as illustrated in FIG. 2 in order to avoid a short-circuit withthe shield can (50).

Although not illustrated, an insulation member such as a separateadhesive member or a spacer may be interposed between the shield can(50) and the electronic circuit pattern (100) exposed on the uppersurface of the guide holder (120), or may be disposed at an uppersurface of the electronic circuit pattern (100). At this time, theinsulation member may be so installed as to surface-contact an entireupper surface of the guide holder (120), or may be so installed as tocontact only an area formed with the electronic circuit pattern (100).

FIG. 4 is a schematic cross-sectional view illustrating a camera moduleaccording to a third exemplary embodiment of the present disclosure.

The camera module according to a third exemplary embodiment of thepresent disclosure is characteristically and structurally same as thatof the second exemplary embodiment, except that an actuator holder (220)is provided to cover an upper surface of the actuator (40) by changing ashape of the guide holder (120, see FIG. 2).

The actuator holder (220) is arranged at an upper surface of the PCB(10), and a lens unit (30) and an actuator (40) are directly installedinside of the actuator holder (220). The actuator holder (220) isdirectly installed thereinside with a lens unit (30) formed with one ormore lenses. An upper surface of the lens unit (30) may be installedwith an actuator (40) configured to automatically adjust a focus of animage captured by the image sensor (11). At this time, as illustrated inFIG. 4, the actuator (40) is configured such that an upper surface ofthe actuator holder (220) wraps the actuator (40). Thus, the actuator(40) may be arranged lower than the upper surface of the actuator holder(220).

Meanwhile, the upper surface of the actuator (40) is provided with atleast two terminal units (40 a), as illustrated in FIG. 7. As a result,at least two through holes (225) may be formed at a positioncorresponding to that of the terminal unit of the actuator (40) at theupper surface of the actuator holder (220). The actuator (40) and theelectronic circuit pattern (100) can be conductively connected throughthe through holes (225). For example, a separate wiring member may beinserted to allow passing through the through hole (225), and theelectronic circuit pattern (100) may be extensively formed at an innercircumferential surface of the through hole (225) as illustrated in FIG.4.

That is, a surface, i.e., a lateral wall and an upper surface, of theactuator holder (220) is formed with the electronic circuit pattern(100) conductively connected to the PCB (10) mounted with the imagesensor (11). At this time, the electronic circuit pattern (100) may beextensively formed to an inner circumferential surface of the throughhole (225). Then, as illustrated in FIG. 4, the terminal unit (40 a)formed at the upper surface of the actuator (40) may be conductivelyconnected at a bottom surface to the electronic circuit pattern (100)through a connection unit (41) formed with a conductible memberincluding a solder or conductive epoxy such as an Ag epoxy. Otherconfigurations are same as those of the first and second exemplaryembodiments.

Although not illustrated, in case of being connected to the actuator byforming a through hole (225) at the actuator holder (220), a separatemechanism such as the shield can (50) configured to protect the actuator(40) may be omitted. Of course, even in this case, the actuator holder(220) and the shield can (50) need to be discretely installed at apredetermined distance (G).

FIG. 5 is a schematic cross-sectional view illustrating a camera moduleaccording to a fourth exemplary embodiment of the present disclosure.

The camera module according to the fourth exemplary embodiment of thepresent disclosure is different from that of the third exemplaryembodiment in light of arranged positions of the lens unit (30) and theactuator (40). That is, the third exemplary embodiment is configuredsuch that the lens unit (30) and the actuator (40) are installed insidethe actuator holder (220), and the actuator (40) is arranged at an uppersurface of the lens unit (30). However, the fourth exemplary embodimentof the present disclosure is differently configured such that theinstallation position of the actuator (40) is changed to a bottom end ofan extreme outer lens (31) in the lenses of the lens unit (30), asillustrated in FIG. 5 of the fourth exemplary embodiment.

At this time, a terminal unit (40 a) of the actuator (40) may besituated at an upper surface of the actuator (40). However, the presentdisclosure is not limited thereto. For example, the terminal unit (40 a)may be installed at a lateral surface or a floor surface of the actuator(40) based on the position of the electronic circuit pattern (100).Furthermore, the terminal unit (40 a) of the actuator (40) may besituated at a surface opposite to the through hole (225) of the actuator(40), as illustrated in FIG. 5.

Meanwhile, a diameter of the extreme outer lens (31) may be smaller thanthat of the actuator (40) or a lens arranged at the bottom surface ofthe actuator (40). The fourth exemplary embodiment of the presentdisclosure is configured such that a connection structure for electricalconnection is not exposed to outside, because the actuator (40) isarranged inside the actuator holder (220). Hence, reliability can beenhanced due to no electrical problem such as short-circuit of theelectrical connection.

Furthermore, a conductive connection unit such as an Ag epoxy can becured inside the actuator holder (220) to allow forming an exterior lookidentical to that of the existing camera module. In addition, theactuator (40) can minimize a problem involving spill lights, because theactuator (40) is arranged inside the actuator holder (220). Besides,mechanisms such as shield can (50) and the protective guide member (55)may be eliminated to be conducive to minimization of the camera modulethrough reduced width, length and height of the camera module.

FIG. 6 is a schematic cross-sectional view illustrating a camera moduleaccording to a fifth exemplary embodiment of the present disclosure.

As illustrated in FIG. 6, the fifth exemplary embodiment of the presentdisclosure is configured such that, similar to the configuration of thesecond exemplary embodiment, a protrusion (121) and a groove (122) areformed on a guide holder (120), where the protrusion (121) supports theshield can (50), and the groove (122) is formed with the electroniccircuit pattern (100) to prevent the electronic circuit pattern (100)from being short-circuited with the shield can (50).

An upper surface of the protrusion (121) may be arranged higher than theactuator (40) to allow the shield can (50) to surface-contact the uppersurface and the lateral surface. The groove (122) may be formed with awidth corresponding to that of the electronic circuit pattern (100).This configuration may allow the protrusion (121) to function as theinsulation member (45) of FIG. 3, thereby eliminating the coatingprocess on the insulation member (45).

Meanwhile, although the first to fifth exemplary embodiments of thepresent disclosure have explained and described that the actuator (40)and the PCB (10) are conductively connected using the electronic circuitpattern (100) formed by the surface electrode pattern formingtechnology, the present disclosure is not limited thereto. For example,the electronic circuit pattern (100) may be formed with ametal-materialed wiring member, which is then inserted and injectionmolded along with the injection molding of the guide holder (120), theactuator holder (220) and the lens unit (30).

Furthermore, although the electronic circuit pattern (100) and theactuator (40), and the electronic circuit pattern (100) and PCB (10) maybe connected using a soldering, an Ag epoxy, a conductive epoxy or awire bonding, the present disclosure is not limited thereto, and anyconductible configuration may be also utilized.

The camera module according to the first to fifth exemplary embodimentsof the present disclosure employ a focus non-adjustment method free fromfocusing process. Hence, the position of the terminal unit (40 a) can beconstantly configured in the course of assembly process, and theposition of the terminal unit (40 a) can be also determined based on anarranged position of the electronic circuit pattern (100). Therefore,design freedom to the arrangement of actuator (40) is high.

Furthermore, in a case the actuator (40) is formed with an LC (LiquidCrystal) lens, a liquid lens or a piezoelectric polymer lens, it ispossible to manufacture a camera module with a low power consumption dueto almost nil power consumption over a camera module with a conventionalactuator of VCM (Voice Coil Motor).

Although the present disclosure has been described with reference to anumber of illustrative embodiments thereof, it should be understood thatnumerous other modifications and embodiments can be devised by thoseskilled in the art that will fall within the spirit and scope of theprinciples of this disclosure.

What is claimed is:
 1. A camera module, the camera module comprising: aPCB (Printed Circuit Board) mounted with an image sensor; a holdermember mounted on the PCB; a lens module directly mounted inside theholder member; an actuator arranged at an upper surface of the holdermember; and an electronic circuit pattern formed on a surface of theholder member to conductibly connect the PCB and the actuator, where oneend of the electronic circuit pattern is connected to the PCB, and theother end of the electronic circuit pattern is connected to theactuator.
 2. The camera module of claim 1, wherein the lens module isformed by any one of a lens unit formed with one or more lenses and alens barrel arranged with lenses.
 3. The camera module of claim 1,further comprising a shield can wrapping a lateral surface and an uppersurface of the holder member.
 4. The camera module of claim 3, whereinan insulation member is interposed between the shield can and the holdermember.
 5. The camera module of claim 4, wherein the insulation memberis an epoxy.
 6. The camera module of claim 3, wherein a protective guidemember is interposed between the shield can and the holder member, andthe protective guide member prevents an exposed surface of theelectronic circuit pattern formed at an upper surface of the holdermember from being short-circuited with the shield can.
 7. A cameramodule, the camera module comprising: a PCB (Printed Circuit Board)mounted with an image sensor; a guide holder mounted on the PCB; a lensmodule directly mounted inside the holder member; an actuator arrangedinside the guide holder; and an electronic circuit pattern formed on asurface of the holder member to conductibly connect the PCB and theactuator, where one end of the electronic circuit pattern is connectedto the PCB, and the other end of the electronic circuit pattern isconnected to the actuator.
 8. The camera module of claim 7, wherein theguide holder is formed with the electronic circuit pattern at a lateralsurface and an upper surface, and at an inner circumferential surfaceaccommodated by the actuator.
 9. The camera module of claim 7, furthercomprising a shield can wrapping a lateral surface of the guide holderwhile being discrete from an upper surface.
 10. The camera module ofclaim 7, wherein an insulation member is interposed between the shieldcan and the guide holder.
 11. A camera module, the camera modulecomprising: a PCB (Printed Circuit Board) mounted with an image sensor;an actuator holder mounted at an upper surface of the PCB and formed atan upper surface with a through hole; a lens module directly mountedinside the actuator holder member; an actuator arranged inside theactuator holder; and an electronic circuit pattern formed on a surfaceof the actuator holder to conductibly connect the PCB and the actuator,where one end of the electronic circuit pattern is connected to the PCB,and the other end of the electronic circuit pattern is connected to theactuator.
 12. The camera module of claim 11, wherein an upper surface ofthe actuator holder is formed to wrap the actuator, and the through holeis arranged at a position corresponding to a terminal unit of theactuator.
 13. The camera module of claim 11, wherein at least twothrough holes are provided.
 14. The camera module of claim 11, whereinthe electronic circuit pattern is formed at a lateral surface and anupper surface of the actuator and at an inner circumferential surface ofthe through hole.
 15. The camera module of claim 11, wherein theactuator is connected to the electronic circuit pattern at a surfacefacing the through hole.
 16. The camera module of claim 11, wherein anoutermost lens is arranged at an upper surface of the actuator.
 17. Thecamera module of claim 16, wherein a diameter of the outermost lens isformed smaller than that of the actuator or other lenses.
 18. The cameramodule of claim 1, wherein the actuator includes any one of a MEMS(Micro Electric Mechanical System) actuator moved by using anelectrostatic force and a piezoelectric force, a liquid crystal lens, apiezoelectric polymer lens, a non-MEMS actuator, a silicon typeactuator, and a liquid lens, or a combination of at least two suchactuators.
 19. The camera module of claim 7, wherein the actuatorincludes any one of a MEMS (Micro Electric Mechanical System) actuatormoved by using an electrostatic force and a piezoelectric force, aliquid crystal lens, a piezoelectric polymer lens, a non-MEMS actuator,a silicon type actuator, and a liquid lens, or a combination of at leasttwo such actuators.
 20. The camera module of claim 11, wherein theactuator includes any one of a MEMS (Micro Electric Mechanical System)actuator moved by using an electrostatic force and a piezoelectricforce, a liquid crystal lens, a piezoelectric polymer lens, a non-MEMSactuator, a silicon type actuator, and a liquid lens, or a combinationof at least two such actuators.
 21. The camera module of claim 16,wherein the actuator includes any one of a MEMS (Micro ElectricMechanical System) actuator moved by using an electrostatic force and apiezoelectric force, a liquid crystal lens, a piezoelectric polymerlens, a non-MEMS actuator, a silicon type actuator, and a liquid lens,or a combination of at least two such actuators.
 22. The camera moduleof claim 1, wherein the actuator performs an auto focusing function or ahandshake compensation function through changes in thickness or shape ofa fixed lens or changes in refractive indexes of incident light.
 23. Thecamera module of claim 7, wherein the actuator performs an auto focusingfunction or a handshake compensation function through changes inthickness or shape of a fixed lens or changes in refractive indexes ofincident light.
 24. The camera module of claim 11, wherein the actuatorperforms an auto focusing function or a handshake compensation functionthrough changes in thickness or shape of a fixed lens or changes inrefractive indexes of incident light.
 25. The camera module of claim 16,wherein the actuator performs an auto focusing function or a handshakecompensation function through changes in thickness or shape of a fixedlens or changes in refractive indexes of incident light.
 26. The cameramodule of claim 1, wherein the electronic circuit pattern and theactuator are connected using a soldering, an Ag epoxy, a conductiveepoxy or a wire bonding.
 27. The camera module of claim 7, wherein theelectronic circuit pattern and the actuator are connected using asoldering, an Ag epoxy, a conductive epoxy or a wire bonding.
 28. Thecamera module of claim 11, wherein the electronic circuit pattern andthe actuator are connected using a soldering, an Ag epoxy, a conductiveepoxy or a wire bonding.
 29. The camera module of claim 16, wherein theelectronic circuit pattern and the actuator are connected using asoldering, an Ag epoxy, a conductive epoxy or a wire bonding.